Benefits:

– Machined with custom pocket dimensions for safe handling and package protection
– Allows Surface Mount components to be picked up in a repeatable fashion when tape and reel is not an option
– Provides pick and place SMT package presentation solution for components for which no standard JEDEC tray exists
– Useful for component bake-out, storage and shipping

Features:

– Aluminum or ESD composite construction
– Pocket can be designed to handle many different package styles including QFP, FP, BGA, LGA, CGA, etc.
– Fast turn times