Benefits
- Machined with custom pocket dimensions for safe handling and package protection
- Allows Surface Mount components to be picked up in a repeatable fashion when tape and reel is not an option
- Provides pick and place SMT package presentation solution for components for which no standard JEDEC tray exists
- Useful for component bake-out, storage and shipping
Features
- ESD safe composite material
- Pocket can be designed to handle many different package styles including
QFP, FP, BGA, LGA, CGA, etc.
- Fast turn times
|
|